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BGA152 alloy flip knob chip test socket

It adopts a manual knob flip-cover structure, which is easy to operate; ※ The IC pressure plate of the upper

BGA291eSSD chip EMMC chip test seat read-write fixture fixture burning socket

Product introduction: New SSD particle packaging form, BGA291ball, the test socket only leads out 174ball for read and write testing.

Customized SOP8-2.53_9.7×10.7 alloy flip probe test socket

We produce customized SOP8-2.53_9.7×10.7 alloy flip-top probe test sockets. We also produce a full range of other chip package test

DP038 Testing Probe

Product head shape: The outer diameter of the probe is 0.38mm, the total length is 5.7mm, and the heads of

GDDR5 Probe Test Socket BGA178 Test Stand

① Applicable to GDDR5 chip with conventional BGA178-0.8 package; ② Dual-head high-frequency test probe, can pass 2.8GHz high-frequency model; ③

P026 Testing Probe

P026 probe, 0.25mm test needle, total length 12.50mm, spring needle, test needle, ejector pin, telescopic probe Product introduction (product overview):

SM2246EN master control to bga272 one-to-two SSD test fixture (256x16MB)

BGA272 flip-up probe one-to-two test socket is a low-cost solution developed by our company for the FLASH industry. The flip-up

SM2256K master control to BGA316 alloy flip cover one to two test fixture

BGA316/TSOP48 one-to-two test socket is a low-cost product developed by our company for the FLASH industry. The flip operation is

SMI2246 One-to-two BGA152/132 double-sided elastic test fixture

Product features: Can test various types of FLASH BGA100/132/152/TSOP48/LGA and other double-sided test sockets can be replaced at will

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