BGA152 alloy flip knob chip test socket

It adopts a manual knob flip-cover structure, which is easy to operate; ※ The IC pressure plate of the upper

BGA291eSSD chip EMMC chip test seat read-write fixture fixture burning socket

Product introduction: New SSD particle packaging form, BGA291ball, the test socket only leads out 174ball for read and write testing.

We produce customized SOP8-2.53_9.7×10.7 alloy flip-top probe test sockets. We also produce a full range of other chip package test

① Applicable to GDDR5 chip with conventional BGA178-0.8 package; ② Dual-head high-frequency test probe, can pass 2.8GHz high-frequency model; ③

BGA272 flip-up probe one-to-two test socket is a low-cost solution developed by our company for the FLASH industry. The flip-up

BGA316/TSOP48 one-to-two test socket is a low-cost product developed by our company for the FLASH industry. The flip operation is

Product features: Can test various types of FLASH BGA100/132/152/TSOP48/LGA and other double-sided test sockets can be replaced at will