Designed for application to all SMD type products, compact camera module clamshell socket provides a connector clip embodying precision in contact, a total interface solution.
Specifications
– Socket type
Single face up/down, Dual and Quad sites face up
– Pitch
0.35P~
– Testing Characteristics
Couple probe on one contact point
Memory IC Test Sockets are used for testing DDR, LPDDR, eMMC, eUFS, etc. Fast signal transmission, low power, and low noise are required in the test. Bomatek Company using advanced precision machining technology and unique design solution to provide sockets for various package sizes for memory chips.
Specifications
– Package Type
BGA, TSOP etc.
– Pitch
0.30P~
Bomatek Technology Company Produce spring probe pin/pogo pin which are widely used for IC socket, board to board connector, battery charger connector. We also provide customers with standard spring probe as well as customized ones.The customized pins can be produced by the request of dimensions, tip form of plungers, spring force, mounting method.
As a structure made of silicon and conductive powder, elastomer is a good solution for high speed, no ball damage, stable CRES, low force and high frequency testing.
Specifications
– Device Spec.
426FBGA _0.35P
– Signal Path
0.35mm
– Bandwidth(@-1dB)
34GHz
– Force / Ball
8g
– Elastomer Thickness
0.45mm
With unparalleled technology, coaxial structure, and high-precision machining equipment, Bomatek company can provide RF test socket with high bandwidth, impedance matching and high frequency up to 40GHz.
Specifications
– Package Type
LGA, FBGA, QFN, WLCSP etc.
– Available pitch
0.25P~
– Characteristic
50Ω Impedance Matching, Coaxial Structure, 40GHz Bandwidth
Bomatek Company has been a leading participating supplier of developing and supplying various types of advanced IC test sockets, test pins.