BGA272 flip-up probe one-to-two test socket is a low-cost solution developed by our company for the FLASH industry. The flip-up operation is simple to replace the chip, and it reduces the damage to the test staff’s hands during large-scale testing! It has become the most cost-effective test socket. This product adopts a bow-shaped spring structure. This structure, coupled with imported beryllium copper gold plating, has good retractable performance. The special crescent-shaped needle can achieve important features that Japanese and other brand test sockets cannot achieve: ours can test both balls, no balls, and residual balls! Other brands can only test new chips with balls.